A Power Module comes with Silicon Carbide (SiC) semiconductors that are more efficient than the existing semiconductors made with Silicon (Si)

• 1. Production capacity: 500,000Set/year
  2. Main Processes: Thermal grease IGBT coating → Cooler ASSY → Cooler cover assembly → DC Capacitor assembly → 3-phase outfoot busbar connection → Airtight inspection of waterway part → Welding → Gateboard connection → Busbar cover & discharge resistance connection → Selective soldering → AOI solder vision measurement → Power module function inspection